年度100
論文名稱Development and Application of Heat Pipe and Vapor Chamber Heat Spreader
會議名稱6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011 and International 3D IC Conference, Taipei
會議開始時間2011-10-18
全部作者康尚文; Kang, Shung-wen; Tsai, Meng-chang
備註會議論文